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Inorganic component analysis

TNA offers quick-turnaround, high-precision composition and trace analysis of inorganic components using various pre-treatment and measurement techniques.


Quantitative Analysis for composition and impurity in Thin Film

  • Quantitative analysis for composition and impurity of thin film utilized on semiconductor
  • Composition analysis for high-k, dielectric, magnetic films, etc.
  • Thickness and weight of metal thin film
  • Trace analysis of impurity in metal thin film

Quantitative analysis for metals, ceramics, medicaments and nanomaterials

  • Composition analysis for silicon nitride materials (ISO17025 certified)
  • Composition analysis complying with industrial standards for steel, non-steel and ceramics
  • Composition, trace element and halogen analysis for fine ceramics
  • Composition and impurity analysis for fluorescent substance
  • Composition analysis for high melting point metal (tungsten, molybdenum etc.)

Composition analysis for trace inorganic components in organic materials

  • Analysis for elution ingredients (metal and ion) from solid material by pore water elution
  • Analysis for metallic impurity in reagent

Analysis relating to manufacturing process

  • Composition analysis for adherent substance inside of equipment or piping
  • Composition analysis for colored or corroded small area


  • Composition analysis of metal materials using ICP-OES
  • Impurity analysis of high-purity metals using ICP-MS
  • Gaseous composition analysis for solid and powder specimen
  • Composition analysis of metal films using XRF
  • Semi quantitative analysis for soda-lime glasses
  • Semi quantitative analysis for Si-N film on silicon wafer
  • Analysis for metallic impurity in photo resists
  • Analysis for metal component in nanomaterials
  • Halogen component analysis using thermal hydrolytic separation
  • Qualitative and semi-quantitative analysis of micro-contaminant particles (up to 10 micron) using ED-micro XRF
  • Observation of internal structure and determination of internal composition in circuit board using ED-micro XRF
  • Composition and impurity analysis for battery materials
  • Composition analysis of adhered powder inside of CVD equipment and piping

Major equipment

  • Inductively coupled plasma mass spectrometer (ICP-MS)
  • Inductively coupled plasma optical emission spectrometer (ICP-OES)
  • Ion chromatography system (IC)
  • Electro-thermal atomic absorption spectrometer (ETAAS)
  • Gas analysis equipment (oxygen, nitrogen, carbon, sulfur)
  • Wavelength-dispersive X-ray fluorescence analyzer (XRF)
  • Energy-dispersive micro X-ray fluorescence analyzer (ED-micro XRF)
  • Thermal hydrolytic separation system

Inductively coupled plasma optical emission spectrometer (ICP-OES) Inductively coupled plasma optical emission spectrometer (ICP-OES)

Analysis cleanroom Analysis cleanroom

Wavelength-dispersive X-ray fluorescence analyzer (XRF) Wavelength-dispersive X-ray fluorescence analyzer (XRF)

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