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TOSHIBA NANOANALYSIS CORPORATION

Services

Defect analysis of semiconductor devices, flat-panel displays (FPDs) and electronic components

TNA offers nanoscale shape observation and composition analysis services for electronic components such as semiconductor devices and flat-panel displays, as well as materials such as ceramics and phosphors.

Our service offerings

Nondestructive testing

  • Nondestructive test of internal structures using 
  •   Transmission X-ray microscope

      X-ray computed tomograph

      Scanning acoustic microscope (SAM)

      Magnetic microscope

Nanostructure analysis

  • Shape observation using
  •   Scanning electron microscope (SEM)

      Transmission electron microscope (TEM)

      Atomic force microscope (AFM)

  • Nanoscale composition analysis using
  •   Scanning electron microscope (SEM)
     /energy-dispersive X-ray spectroscopy (EDS)

      Electron probe microanalyzer (EPMA)

Material analysis

  • Observation of metal nanostructures

Examples

  • Observation of nano-recording marks on recording media such as DVD and Blu-ray discs
  • Surface and cross-sectional observation of FPDs
  • Surface and cross-sectional observation of ceramic and other nanoparticles
  • Cross-sectional observation of porous materials using ion milling
  • Cross-sectional observation of sintered ceramics
  • Cross-sectional observation of soft porous materials
  • Cross-sectional observation of the electrodes for a rechargeable lithium-ion battery
  • 3D Analysis by X-ray microscope and FIB

Major equipment

  • Transmission X-ray microscope
  • X-ray computed tomography
  • Scanning acoustic microscope (SAM)
  • Scanning acoustic tomograph (SAT)
  • Scanning electron microscope (SEM)
  • Transmission electron microscope (TEM)
  • Atomic force microscope (AFM)
  • Scanning capacitance microscope (SCM)
  • Focused ion beam (FIB) milling system
  • Cross-section and surface grinders, cutting machine

Observation of a Blu-ray Disc using a low-energy SEM
Observation of a Blu-ray Disc using a low-energy SEM

Observation of voids in solder
Observation of voids in solder

Observation of an alloy layer in copper (Cu) bonding
Observation of an alloy layer in copper (Cu) bonding

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