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TOSHIBA NANOANALYSIS CORPORATION

Services

Trace-level Composition Analysis

TNA offers analysis and evaluation technologies built up through decades of experience as a semiconductor device manufacturer.

Our service offerings

Semiconductor wafer analysis

  • Trace metal analysis of wafer surfaces, absorbed ions, and absorbed organic molecules

Other related technologies

  • Standard wafers for total reflection X-ray fluorescence (TXRF), fabrication of waters with a controlled metal contamination level

Examples

Semiconductor wafer analysis

  • Analysis of contamination on wafer surfaces (front, back, edge, and bevel)
  • Full-automatic high-precision trace metal analysis of water surfaces
  • Analysis of step etching

Other related technologies

  • Fabrication of wafers with a controlled metal contamination level (dip and spray methods)

Major equipment

  • Automatic preprocessing system for trace metal analysis of wafer surfaces
  • Inductively coupled plasma mass spectrometer (ICP-MS)
  • Electrothermal atomic absorption spectrometer (ETAAS)
  • Time-of-flight secondary ion mass spectrometer (TOF-SIMS)
  • Fourier transform infrared spectroscope (FT-IR)
  • Raman spectroscopic analyzer
  • Ion chromatography system (IC)
  • Gas chromatograph-mass spectrometer (GC/MS)
  • Total organic carbon analyzer (TOC)

Trace metal analysis of wafer surfaces
Trace metal analysis of wafer surfaces

Ion chromatography (IC)
Ion chromatography (IC)

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